Products
Explore our carefully crafted product series
IV-4000 Series
Inspection of die and wire bonding on substrates or lead frames.
System Enclosure Dimensions:
1600 x 1200 x 2000mm(WxDxH)
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Chip / Wire Bond Inspection
IV-E1700
Inspection of die bonding and gold/copper/aluminum wire bonding for substrates or lead frame products.
System Enclosure Dimensions:
1600 x 1200 x 2000mm(WxDxH)
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Chip / Wire Bond Inspection
IV-5000 Series
Chip / Wire Bond Inspection – High-Speed Model
System Enclosure Dimensions:
1500×1300×1700mm(W×D×H)
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Chip / Wire Bond Inspection
IV-W2000
Wafer Inspection Suitable for the whole process inspection before and after back-end dicing
System Enclosure Dimensions:
1400 x 1150 x 1540 mm (WxDxH)
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Backend Wafer Dicing Inspection
IV-T3300
Post Wire Bond & Die Bond Inspection Equipment
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Chip / Wire Bond Inspection