Backend Wafer Dicing Inspection
IV-W2000
Wafer Inspection Suitable for the whole process inspection before and after back-end dicing
Product Details
- Equipped with Wafer Map system
- Supports review of wafer inspection results
- Supports partial wafer inspection and wafer zone inspection
- Supports user-defined Reject Bins and codes
- Enables automatic calibration and inspection of wafers carried on wafer frames / wafer rings
- Can generate process yield summary reports; the software supports automatic rotation for eMap display
Technical Specifications 1 specs
| System Enclosure Dimensions | 1400 x 1150 x 1540 mm (WxDxH) |